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Description of Printed-Circuit Board
Description of Printed-Circuit Board
Introduction to Printed Circuit Board (PCB)

As literally designated, Printed Circuit Board or PCB is a wiring board produced using print.
A circuit of single-sided board of an early date is made by bonding a layer of copper over the entire surface of Bakelite on substrate, then melting down unwanted copper by etching using ferric chloride (copper) after applying a mask onto the wiring part of the substrate by silk screen printing.
Even now, masking + etching technique of wiring part is mainly used as a basic technique.
("Subtractive" methods)
"Additive" processes (wiring a circuit that is formed by plating) also exist.

History of Printed Circuit Board (PCB)

Metalikon process spray wiring method, in which the patent was published in 1936, is the prototype of printed circuit board in Japan. In the post-war period, the largest patent litigation in history - whirlwind of Techno-graph, occurred in US, was PCB patent infringement case in which the patent was owned by Techno-graph Corporation. However, no payment for royalty was required for Japanese products, as referred to above-mentioned; Japan has ready obtained the national patent. Cited from ‘Printed Circuit Technology Reader’

Latest Technology in Printed Circuit Board

Density growth is advancing. As a result of PCB became multi-stratified and conductor width and conductor spacing are more narrowed, high density wiring board is currently well under way. Additionally, densely-produced product is under development, which likely to be made up as a semiconductor component from a simple wiring board.

Future of Printed Circuit Board

Moving away from the wiring board, PCB is more likely to be no production barrier with semiconductor process. In fact, it is already being linked between the production process of PCBs and flat-panels.

MARUGEN Technology Implication with Printed Circuit Board

We have started our business with manufacture and distributor of scrubbing machine for furniture production as indigenous industry. After we were asked for trial grinding for printed circuit board at the Woodworking Machinery Exhibition in 1983, our development of machines for printed circuit board is off to a promising start with the scrubbing performance with dry belt sander, at the exhibition, was delivered excellent result exceeding our expectation. The substrate we used at the site, was silk-screen printed on the double sided board of through hole protection UV inks.

Scrubbing in Production Process of Printed Circuit Board
Pre-plating Process

Surface cleaning and conditioning to promote deburring after drilling holes and plate adhesion

Pre-pattern formation Scrubbing (Pre-dry film scrubbing)

This scrubbing process is for enhancing anchor effect to promote D/F adhesion

Pre-solder mask Scrubbing (Pre-PSR Process)

This scrubbing process is for surface cleaning and conditioning after forming pattern and enhance anchor effect.

Removing of inks in holes

Remove excess resin in holes before forming circuit
Protect Through hole
Remove surface IBH resin
Remove resin in holes after forming circuit

Scrubbing SUS board

Clean the board of jig for multi-layer pressing
If the resins heavily adhered in some scrubbing process, the resins may not be able to remove with scrubbing.

Further Process

Levelling for build-up layers
Scrubbing for planarizing process after forming additive circuit

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